ACoolTPS - Advanced Cooling of high power microsystems using Two-Phase Flows Systems in complex geometries
Cooling of electronics is a challenging subject due to the fast growth of computer processing capacity. Cooling of datacenters is estimated to have an annual electricity cost of 1.4 billion dollars in the USA and over 3 billion dollars worldwide. Currently, pure air/water cooling is the most widely used means for thermal regulation of datacenters, which represents around 45% of the total energy consumed in a datacenter. However, the energy efficiency of these methods is very low. Therefore, improvements are essential to ensure faster processors with sustainable energy management. Phase-change cooling devices directly over processor chips using microchannels offer promise to reduce such a demanding energy consumption. These are light-weight and hence can be used to cool electronics on earth and in space This is because as liquids evaporate they remove more heat than non-vaporising liquids. However, phase-change liquids pose major design challenges due to the presence of both liquid and vapour phases in the cooling device. This work aims to enhance our understanding of the underlying phenomena using advanced computational methods. Simulations can give an unprecedented insight into the dynamics eventually helping design low cost and energy-efficient microchannel cooling devices. We propose to further develop our simulators accounting for complex geometries, process the generated large scale data using machine learning and validate simulations using experiments. Edinburgh’s expertise in computational and experimental phase-change, parallel computing, and machine-learning will complement the Brazilian team’s expertise in finite-element models. The advanced simulators resulting from this project will be made freely available to public.