Finite Element Analysis Applied on the Cooling of Electronic Components

Abstract

The numerical simulation is an important tool to solve problems found in several physical processes, such as oil drilling, reservoir filling, hemodynamics and cooling of electronic components, the latter of great importance for describing problems related to controling flow and temperature conditions for new generation of stack processors. It is in this scope this project retains, for the development and improvement of a numerical platform using finite elements method simulation in order to study, in details, physical processes involved in cooling the eletronic components, specifically the characterization of temperature distribution in flows within different geometry. With this project, the objective is to comprehend, in detail, the mechanisms of heat dissipation in modern electronic components. Furthermore, it is also desired to have a better understanding of which alternatives present the most efficient cooling.